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-                   ZTnews
+   A ZT Services Publication on Thermoelectricity
-             "All Z News, All Z Time"
+       Made possible by contributions from:
-   International Thermoelectric Society, http://www.its.org/
+   BSST/Amerigon, http://www.bsst.com/
-   EIC Solutions, Inc., http://www.eicsolutionsinc.com
+   FerroTec, http://www.ferrotec.com/products/thermal/
-   Global Thermoelectrics, http://www.globalte.com
+   Hi-Z, http://www.hi-z.com/
-   ITTJ, http://www.zts.com/ittj/
+   Marlow Industries, http://www.marlow.com/
-   Marvel, http://www.marvelte.com/
+   Melcor, http://www.melcor.com/
-   TE Technology, http://www.tetech.com/
+   Tellurex, http://www.tellurex.com/
-   Thermion, http://www.thermion-company.com/
+
-        Check them out at http://www.zts.com/
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-        ZTnews for 20070905 (That's September 5, 2007)
+             Cronin B. Vining, Listmaster
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CONTENTS
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NEWS:
      +- Implantable Thermoelectric Device Helps Epilepsy
         http://www.zts.com/node/5229

      +- ECT2007 Updates
         http://ect2007.thermion-company.com/taxonomy_menu/2/5

JOBS:
      +- Postdoc Research Associate Position at MSU
         Thermoelectric Module Development and Testing
         http://www.zts.com/node/5221

      +- Postdoctoral Position
         Thermoelectric device development and testing
         Nanyang Technological University (Singapore)
         http://www.zts.com/node/5222

UPCOMING EVENTS UPDATES:  (+-+-  = New Info., Full list below.)

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NEWS:
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      +- Implantable Thermoelectric Device Helps Epilepsy
         http://www.zts.com/node/5229

This is actually a couple years old, but I stumbled across it today.

A team at Rensselaer and the Washington University of Medicine in St.
Louis are developing a small, implantable thermoelectric device and heat
pipe to cool specific portions of the brain and help inhibit epileptic
seizures.  The full story:

    http://news.rpi.edu/campusnews/update.do [1]

indicates in 2005 they were moving toward testing in primates.

A journal review article on the subject is available:

Model, N.S., Focal Cooling Rapidly Terminates Experimental Neocortical
Seizures. Annals of Neurology, 2001. 49(6): p. 721-726.

and a pdf of the review is available online [2]:

Links:
[1] http://news.rpi.edu/campusnews/update.do
[2]
http://www.neuro.wustl.edu/bio5663/2006/Focal%20Cooling%20Epilepsy%20Behavior%20Review.pdf

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      +- ECT2007 Updates
         V. Semenyuk, ECT2007 Chairman
         http://ect2007.thermion-company.com/taxonomy_menu/2/5

Important updates for ECT2007 have been mailed to participants and are
posted on the conference website for reference.  If you plan to attend
ECT2007, please read these important announcements:

ECT2007: Book of proceedings
    http://ect2007.thermion-company.com/node/53

ECT2007: Your flight details
    http://ect2007.thermion-company.com/node/54

ECT2007: Your flight details - 2
    http://ect2007.thermion-company.com/node/55

Kind regards,

V. Semenyuk
ECT2007 Chairman
 ----------------------------------
   Dr. V. Semenyuk
   Conference Chairman
   Phone/Fax: +380 (482) 63 8324
   Phone/Fax: +380 (48) 760 1834
   E-mail: ect2007 [at] ets-thermion [dot] org
 ----------------------------------

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JOBS:
+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-
      +- Postdoc Research Associate Position at MSU
         Thermoelectric Module Development and Testing
         http://www.zts.com/node/5221

Research Associate Position (Thermoelectric Module Development and Testing):

The applicant will assist in the research and development of high
efficiency thermoelectric modules, which involves material synthesis,
and characterization, module fabrication (cutting of module legs,
bonding, and encapsulation), and module testing. Applicants should have
a Ph.D. in Electrical Engineering, Materials Science, Chemistry,
Physics, or similar discipline. Experience with characterization of
materials is a strong advantage. An understanding of temperature
dependent transport properties including thermal conductivity,
thermopower, and electrical conductivity is desired. The appointment is
initially for a one-year period, with a possible extension contingent on
performance and project funding.

Contact:

    Tim Hogan
    Associate Professor
    Michigan State University
    Electrical and Computer Engineering Department
    2120 Engineering Building
    East Lansing, MI 48824-1226
    Phone: (517) 432-3176
    Fax: (517) 353-1980
    Email: hogant [at] msu [dot] edu

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      +- Postdoctoral Position
         Thermoelectric device development and testing
         Nanyang Technological University (Singapore)
         http://www.zts.com/node/5222

The applicant will assist in the research and development of high
efficiency thermoelectric device, which involves material synthesis,
device design, fabrication and testing. Applicants should have a Ph.D.
in Electrical Engineering, Materials Engineering or similar discipline.
Experience with thermoelectric device development is a strong advantage.
The appointment is initially for a one-year period, with a possible
extension contingent on performance and project funding.

Please send your application with CV, your research interests, a list of
publications and the names of two academic referees to:

    Dr. Huey Hoon HNG
    School of Materials Science & Engineering
    Nanyang Technological University
    Block N4.1, Nanyang Ave
    Singapore 639798
    SINGAPORE
    Email: ashhhng [at] ntu [dot] edu [dot] sg

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UPCOMING EVENTS ( +-+- = New or Updated Information):
+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-+-
     +- ECT2007 - 5th European Conference on Thermoelectrics
        From: 2007-09-09 Through: 2007-09-12
        Location: - Odessa, Ukraine
        Contact: Vladimir Semenyuk ect2007 [at] ets-thermion [dot] org
                 Ph:+380 (482) 63-8324, FAX+380 (48) 760-1834
        Abstract Due Date: May 1, 2007
        Higher Fees May Apply After: June 15, 2007
        Website: http://ect2007.thermion-company.com
        Info Last Updated: 2006-12-20

    +- MS&T'07: Nano-Processing
       From: 2007-09-16 Through: 2007-09-20
       Location: COBE Center - Detroit, Michigan, USA
       Contact: Biprodas Dutta biprod [at] vsl [dot] cua [dot] edu
                Ph:+1 614-794-5868, FAX
       Abstract Due Date: March 15, 2007
       Higher Fees May Apply After:
       Website: http://www.matscitech.org/2007/
       Info Last Updated: 2007-02-03

    +- PacRim7
       From: 2007-11-11 Through: 2007-11-14
       Location: Shanghai International Convention Center
                 - Shanghai, CHINA
       Contact: Wenqing Zhang wqzhang [at] mail [dot] sic [dot] ac [dot] cn
                Ph:+86-21-5241-2416, FAX+86-21-5241-3122
       Abstract Due Date: May 1, 2007
       Higher Fees May Apply After: September 30, 2007
       Website: http://www.sic.ac.cn/meeting/pacrim7/
       Info Last Updated: 2007-01-10

    +- Fall 2007 MRS Symposium U: Thermoelectric Power Generation
       From: 2007-11-26 Through: 2007-11-30
       Location: Hynes Convention Center and Sheraton Boston Hotel
                 Boston, MA, USA
       Contact: Timothy Hogan hogant [at] egr [dot] msu [dot] edu
                Ph: +1 (517) 432-3176, FAX:
       Abstract Due Date: June 20, 2007
       Higher Fees May Apply After: TBD
       Website: http://www.mrs.org/s_mrs/doc.asp?CID=8005&DID=192319
       Info Last Updated: 2007-05-02

    +- Advanced Processing for Novel Functional Materials - APNFM 2008
       From: 2008-01-23 Through: 2008-01-25
       Location: International Congress Center - Dresden, Germany
       Contact: Dr. Jürgen Schmidt info [at] apnfm [dot] de
                Ph: +49 (0) 351 2537 324, FAX: +49 (0) 351 2554 462
       Abstract Due Date: 31 July 2007
       Higher Fees May Apply After: 1 December 2007
       Website: http://www.apnfm.de/
       Info Last Updated: 2007-05-22

     +- ICT2008, Corvalis, Oregon USA
        From: 2008-08-03 Through: 2008-08-07
        Location: LaSells Stewart Conference - Corvallis, Oregon, USA
        Contact: David Johnson davej [at] uoregon [dot] edu
                 Ph:+1 541-346-4612, FAX
        Website: http://www.its.org
        Info Last Updated: 2006-12-20